18 microelectronics-"https:"-"https:"-"https:"-"https:"-"https:"-"CNRS-LIRMM" positions in Germany
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technology—is offering the opportunity to write a thesis on the topic: »DUV-Assisted Athermal Laser Grooving of Low-κ Dielectrics for Advanced Packaging«. In advanced microelectronic packaging, low-κ
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) are key materials in advanced microelectronic packaging, yet their ultrafast optical response to deep-UV femtosecond excitation remains entirely unexplored. Understanding the transient free-carrier dynamics
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Scientific exchange and presentation of research results at conferences and participation in workshops What you contribute Completed university degree (master's/diploma) in microelectronics, materials science
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contribute Degree: You have completed a degree (Bachelor’s or Diploma (UAS)) in electrical engineering, microelectronics, computer science, or a comparable field of study. Expertise: You now have at least 2
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-house for a sustainable and secure society. When will you join us? What you will do The Microelectronics (ME) department designs microelectronic components and circuits for high-frequency technology and
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of renewable energy, energy storage, and cross-border infrastructure) Artificial intelligence and digitalization, as well as microelectronics (e.g., strengthening Europe’s digital sovereignty, research on AI
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, as well as microelectronics (e.g., strengthening Europe’s digital sovereignty, research on AI applications, ethical standards, and cybersecurity; research on innovative, AI-enabled chip applications
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Electronics and Devices Institute of Automation Institute for Microsensors, -Actuators and -Systems Institute of Electrodynamics and Microelectronics Institute for Telecommunications and High-Frequency