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, condensed-matter physics, neutron scattering, applied mathematics, and scientific computing. This position resides within the Quantum Sensing and Computing Group in the Computational Sciences and Engineering
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guided by AI/ML, remote sensing, process-based modeling, field observations and experiments, and advanced analytical techniques. Major Duties/Responsibilities: Independently and collaboratively lead field
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to additive manufacturing (AM), virtual manufacturing, material characterization, topology optimization, and real-time sensing. This position resides in the Computational Sciences and Engineering Division (CSED
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. The candidate will collaborate with multidisciplinary researchers in robotics, surveying, remote sensing, and artificial intelligence. This on-site position resides in the Building Envelope Materials Research
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to [email protected] (For postdocs, use [email protected] ) with the position title and number referenced in the subject line. Instructions to upload documents to your candidate profile: Login
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when applying to this position. You may upload these directly to your application or have them sent to [email protected] (For postdocs, use [email protected] ) with the position title
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analysis by integrating diverse datasets (e.g., in situ observations, remote sensing products, model simulations) to inform model development, calibration, and validation. Collaborate with a
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(For postdocs, use [email protected] ) with the position title and number referenced in the subject line. Instructions to upload documents to your candidate profile: Login to your account via
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publication in relevant areas such as computer architecture, HPC, quantum computing, compilers/runtime systems, or heterogeneous computing. Special Requirements: Postdocs: Applicants cannot have received
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. Special Requirements: Postdocs: Applicants cannot have received their Ph.D. more than five years prior to the date of application and must complete all degree requirements before starting their appointment