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Veterinärmedizinische Universität Wien (University of Veterinary Medicine Vienna) | Austria | 23 days ago
» Veterinary medicineEducation LevelPhD or equivalent Specific Requirements Completed degree in Biology or another natural science, as well as a completed doctorate/PhD • Extensive experience in animal
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to solutions with clear scientific and industrial relevance. Where to apply Website https://www.academictransfer.com/en/jobs/363997/2-phd-positions-on-measuring-th… Requirements Specific Requirements Your
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research areas: Chiplets; 2.5D/3D integration; thermal/reliability co-design; advanced interconnects; packaging-aware design methodologies. Teaching contributions: Heterogeneous Integration & Advanced
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research areas: Chiplets; 2.5D/3D integration; thermal/reliability co-design; advanced interconnects; packaging-aware design methodologies. Teaching contributions: Heterogeneous Integration & Advanced
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knowledge security. Please do not contact us for unsolicited services. Where to apply Website https://www.academictransfer.com/en/jobs/364141/phd-position-experimental-valid… Requirements Additional
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knowledge security. Please do not contact us for unsolicited services. Where to apply Website https://www.academictransfer.com/en/jobs/364394/phd-position-in-decoding-enviro… Requirements Additional
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Classification Title: Research Assistant Scientist Classification Minimum Requirements: PhD in Electrical Engineering or a closely related field. Job Description: The Department of Electrical
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Multiple Tenure-Track Assistant Professor Positions in Microelectronics, Circuits and Systems Design
Heterogeneous Integration Key research areas: Chiplets; 2.5D/3D integration; thermal/reliability co-design; advanced interconnects; packaging-aware design methodologies. Teaching contributions: Heterogeneous
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decisions. The role would suit a scientist who combines strong technical capability with careful experimental practice, enjoys working collaboratively, and takes pride in establishing reliable biological
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Multiple Tenure-Track Assistant Professor Positions in Microelectronics, Circuits and Systems Design
Heterogeneous Integration Key research areas: Chiplets; 2.5D/3D integration; thermal/reliability co-design; advanced interconnects; packaging-aware design methodologies. Teaching contributions: Heterogeneous