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European workplaces and gender (in)equality’. The project is part of the Horizon funded programme ‘Reimagining Work and Care: Gender Equality, Couple Dynamics, and Policy Innovation in Europe (REWORC), led
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multidimensional feature space of visual information to support data-driven journalism. This includes experiments for accountability, transparency, inclusiveness, and misinformation. The key technology is multimodal
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20 Aug 2026 Job Information Organisation/Company Maastricht University (UM) Research Field Engineering » Biomedical engineering Researcher Profile Recognised Researcher (R2) Application Deadline 15
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10 Jul 2026 Job Information Organisation/Company Eindhoven University of Technology (TU/e) Research Field Computer science » Informatics Computer science » Programming Educational sciences
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Are you excited about pushing the boundaries of ultrasound imaging? Join our team to develop next-generation multi-aperture ultrasound technology combining distributed sensing, adaptive acquisition
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Are you passionate about healthcare, technology, innovation, physics and radiochemistry? Are you looking for a challenging role where you can apply your expertise to help improve patient care? Then
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users to bring quantum technology to the market. Want to know more about our organisation? Read more about working at the University of Amsterdam. If you feel the profile fits you, and you are interested
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17 Sep 2026 Job Information Organisation/Company Radboud University Research Field Physics » Mathematical physics Physics » Statistical physics Researcher Profile Recognised Researcher (R2
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this, among other things, to prevent the unwanted transfer of sensitive knowledge and technology. You can only apply via our online application system using the 'Apply now' button. Applications submitted by
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked