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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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this, among other things, to prevent the unwanted transfer of sensitive knowledge and technology. You can only apply via our online application system using the 'Apply now' button. Applications submitted by
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17 Sep 2026 Job Information Organisation/Company Radboud University Research Field Physics » Mathematical physics Physics » Statistical physics Researcher Profile Recognised Researcher (R2
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machine learning; acoustic signal processing enhanced by ML; human-in-the-loop/active-learning methods; representation learning; analysing sound sequences and vocal interactions; category discovery; Perma
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21 Jul 2026 Job Information Organisation/Company Vrije Universiteit Amsterdam (VU) Research Field Engineering » Civil engineering Environmental science » Global change Researcher Profile Recognised
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Observation Programmes. You will also cooperate with scientists and engineers from EOP-FA (the System Architect Office) at ESTEC, and potentially with staff in other parts of ESA. You will be part of the ESA Φ
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Biomolecular Sciences and Biotechnology Institute (GBB), Faculty of Science and Engineering. The position is part of the ERC Starting Grant project ACTIN in ACTION, which investigates the molecular mechanisms
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gravitational physics with historical and conceptual research on entropy, randomness and chaos. What makes these positions distinctive is the opportunity to pursue specialised research while being part of a
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15 Aug 2026 Job Information Organisation/Company Utrecht University Research Field Environmental science » Global change Environmental science » Natural resources management Researcher Profile
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Vacancies Postdoc in Sustainable Circular Business Models and Finance in Hubs for Circularity Key takeaways The Challenge As process industries transition to circular models, companies within Hubs