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characterization of final structures. Device performance and reliability of the final structures under thermal, mechanical and electrical stressors should be considered. key words flexible electronics; materials
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that contributes to reliable manufacturing of the next generation computing devices. Computational imaging methods such as coherent diffractive imaging, Fourier ptychography, structured illumination techniques, and
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of failure strengths are needed to ensure reliability and maximize performance. We use numerous modeling approaches to explore the mechanical and electrical behavior of deforming nanoscale systems. Current
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nontrivial limitations in obtaining reliable, rapid measurements that are sensitive to HOS. We develop advanced vibrational spectroscopic techniques that are more sensitive to structured molecular backbones
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distorts the electronic wave functions and perturbs the associated energy levels. This effect is likely to be a serious material issue, which can affect the reliability and the performance of the finished
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correlations were traditionally developed on the basis of some reliable but often very limited data compilations. Currently, large comprehensive experimental data collections have not only become more readily