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maintenance of the ESA Space Debris Mitigation Policy and Requirements independent supervision of the verification of compliance of ESA projects with the Space Debris Mitigation Requirements processing
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; contact information of referees (not reference letters); a list of publications A knowledge security check can be part of the selection procedure. (for details: national knowledge security guidelines )
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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diversity of platforms and building blocks. The foundry model is now becoming established where Process Design Kits (PDKs) allow fabless designers to create their own chips with custom functionality. While
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translate those insights into concrete governance frameworks. In the process we plan to identify a set of independently verifiable safeguards (legal, technical, economic, and governance‐based) that make a
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Climate change is one of the greatest challenges for global food security, requiring new approaches to understand and harness the natural diversity that enables plants and their associated microbiomes to adapt to environmental change. Ancient environmental DNA (eDNA) provides a unique record of...
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packaging process works and how the N-protein manages to selectively pack genomic RNA is not well-understood. We will study this selective packaging theoretically, in tight collaboration with experimental
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postdoctoral position lies at the interface of fluid mechanics, phase-change physics, and industrial application. It is part of ARCNL’s Source Department and the EUV Plasma Processes group. We investigate
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strong role in packaging the genomic RNA; yet, how this packaging process works and how the N-protein manages to selectively pack genomic RNA is not well-understood. We will study this selective packaging
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-reviewed journals. Nice-to-haves: Experience with seismic processing and inversion. Experience with finite difference wave-equation solvers such as SeisSol or SPECFEM3D. Affinity with the advancement