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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | 16 days ago
Posting Information Posting Details Department Lampe Biomedical Engineering - 424601 Posting Open Date 09/10/2026 Application Deadline 09/23/2026 Open Until Filled No Position Type Postdoctoral
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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | 2 days ago
Posting Information Posting Details Department Lampe Biomedical Engineering - 424601 Posting Open Date 09/10/2026 Application Deadline 10/07/2026 Open Until Filled No Position Type Postdoctoral
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. DUTIES The postdoc will perform gas fermentation experiments in both bottle and bioreactor cultures to phenotype various carbon oxide (CO or CO2) fixing native and engineered microbial strains
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19 Sep 2026 Job Information Organisation/Company CNRS Department Laboratoire Navier Research Field Engineering Physics » Acoustics Engineering » Materials engineering Researcher Profile First Stage
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19 Sep 2026 Job Information Organisation/Company CNRS Department Institut d'Electronique de Microélectronique et de Nanotechnologie Research Field Engineering Physics Technology Researcher Profile
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Do you have an ambitious research idea that you wish to pursue in your postdoc? Are you interested in theoretical or computational science in an interdisciplinary environment? Then HITS is the
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Posting Description Chemical Engineering (ChemE)-Machine Learning for Pharmaceutical Discovery and Synthesis (MLPDS) Consortium , to be partially responsible for the continued development and
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- Assistant Professor, 280-NN_FACULTY - Associate Professor Business Title: Tenure-Track/Tenured Faculty Position in Electrical Engineering Employee Type: Faculty Position Term: 9 Month Position Details
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of new treatments including in vitro and in vivo proof-of-concept efficacy data. This is an opportunity to work across multiple disciplines spanning retinal biology, viral vector technology and
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked