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(R2) Positions Postdoc Positions Application Deadline 12 Oct 2026 - 00:00 (UTC) Country France Type of Contract Temporary Job Status Full-time Hours Per Week 35 Offer Starting Date 1 Dec 2026 Is the job
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description How can we accelerate the discovery of next-generation materials — from
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Investigative Therapeutic Exchange (MJFF LITE) Initiative This post contributes to a major Parkinson's disease programme sponsored by the MJFF and led by Dundee, uniting academic, clinical and industry partners
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Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description The recruited candidate will have the overall mission
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scientifically educated and application-driven by providing a balanced education and research program that combines fundamental and application aspects. We equip our graduates with practical and theoretical
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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | 1 day ago
research universities in the nation for federal research expenditures as well as for federally funded social and behavioral sciences research and development. Here at Carolina, our highly skilled postdocs
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for the Protection of Systems and Information (EIPSI), in the department of Mathematics and Computer Science. The work is carried out in collaboration with QUANT at Twente University and QSA Technology, as well as TU
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(R2) Positions Postdoc Positions Application Deadline 13 Oct 2026 - 14:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Is the job funded through the EU Research
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of novel therapies for retinal diseases in human clinical trials. We are seeking a highly motivated postdoctoral research assistant to join our translational gene therapy program, developing novel adeno
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip