Sort by
Refine Your Search
-
for Position: Ben Sulman ([email protected]) Special Requirements: Applicants cannot have received their Ph.D. more than five years prior to the date of application and must complete all degree requirements
-
. This position will remain open for a minimum of 5 days after which it will close when a qualified candidate is identified and/or hired. We accept Word (.doc, .docx), Adobe (unsecured .pdf), Rich Text Format (.rtf
-
. The position offers the opportunity to work at the interface of model development, observational data synthesis, and emerging AI/ML methods, in close collaboration with researchers from the SPRUCE (Spruce and
-
. The position offers the opportunity to work at the interface of model development, observational data synthesis, and emerging AI/ML methods, in close collaboration with researchers from the SPRUCE (Spruce and
-
to science. Experience conducting field work independently or as part of a team. Contact for Position: Elizabeth Herndon ([email protected]) Special Requirements: Applicants cannot have received their Ph.D
-
extensions are subject to performance and availability of funding. Visa sponsorship: Visa sponsorship is not available for this position. Security, Credentialing, and Eligibility Requirements: Q Clearance with
-
advanced manufacturing processes. This position resides in the Deposition Science and Technology Group in the Manufacturing Science Division (MSD), Energy Science and Technology Directorate (ESTD) at Oak
-
. This position will remain open for a minimum of 5 days after which it will close when a qualified candidate is identified and/or hired. We accept Word (.doc, .docx), Adobe (unsecured .pdf), Rich Text Format (.rtf
-
of funding. Letters of Recommendation: Please submit three letters of reference when applying to this position. You may upload these directly to your application or have them sent to [email protected]
-
contribute to developing and improving the performance of next-generation thermal systems—including HVAC, water heating, and data center cooling—at both the system and component level. This position resides in