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colleague with: - An M.Sc./Master’s degree in polymer engineering/technology, materials sciences, or equivalent engineering degrees with a focus or experience in composites and compounding. - Passion
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application development that is integrated to methods of the polymer recovery starting from a PHA-rich biomass. Today, to enhance the viability and ensure storage stability of seeds, they are modified by thin
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Chemistry and Material Lab Technician Coordinator, you manage state-of-the-art equipment for synthesis and characterization of organic compounds and polymers. You are responsible for the maintenance and
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(or soon obtain) a Master of Science background in polymer science, chemical technology, or physical chemistry, with expertise in electrochemistry. Practical skills are essential, alongside the ability
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involve collaboration with material scientists who are developing responsive polymers driven by electric fields. The PCB Design Engineer will work closely with these scientists to integrate these innovative
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scientists who are developing responsive polymers driven by electric fields. The PCB Design Engineer will work closely with these scientists to integrate these innovative materials into our products, ensuring
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2023.14 Developing high-throughput membrane adsorbers via electrospinning for selective PFAS removal
threatening the quality of our drinking water urgently has to be removed from the environment. A highly flexible approach for the selective capturing of components from aqueous streams are polymer membrane
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Bridges and wind turbine towers are two main areas in need of resilient high-performance materials. Fibre-reinforced polymer (FRP) composites are showing great promise. Yet to meet future demand, it
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-integration, 3D packaging technology, such as flip-chip or through-polymer vias will be considered to enable the integration of BiCMOS and InP dies. Requirements Specific Requirements Applicants must have or
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design. As a part of this co-integration, 3D packaging technology, such as flip-chip or through-polymer vias will be considered to enable the integration of BiCMOS and InP dies. Job requirements Applicants