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models and machine learning techniques for kinetic equations arising from plasma and neutron transport. The position will be based at Virginia Tech’s campus in Blacksburg, VA. The postdoc will have a
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Department of Electrical and Computer Engineering. The Postdoc will particularly participate in the design and development of integrated system-on-chips for wireless sensing, communication, and implantable
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). The PhD must be awarded no more than four years prior to the appointment effective date so that the candidate has the VT required minimum of one year eligibility as a VT Postdoc. - Demonstrated experience
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tailored to their career goals. Postdocs are actively mentored to publish, present, build collaborations, and compete for fellowships and career-development awards (e.g., NIH F32, K99/R00). The position is
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Job Description We are seeking a highly motivated Postdoctoral Associate - Community-Centered Physical AI for Smart Urban Management to contribute to a 1-year research agenda on community-centered
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administrative data - Experience with process mapping and/or process improvement - Experience building solutions within policy, legal, and contractual requirements as part of a larger team Overtime Status Exempt
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. The candidate will apply a suite of statistical and physical models for integrating observations of different accuracies, improving predictions of future hazards. The work will further include research, writing
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of agentic AI systems for accelerating computational catalysis and experimental design. The successful candidate will contribute to building AI-native frameworks that combine physics-based modeling, machine
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collaborators. Required Qualifications • PhD in neuroscience, physics, computer science, applied mathematics, biomedical engineering, or a related quantitative field. PhD awarded no more than four years prior
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systems. • Develop and implement predictive models for packaging performance using machine learning approaches and physics-based simulations. • Investigate logistics optimization strategies for packaging