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Explore fundamental spin physics at the interface of acoustics and MRI, and help develop a new imaging contrast sensitive to microscopic magnetic-field inhomogeneities. Job description We
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project, you will develop and validate experimental methods to study wafer bonding in a quantitative and physics-based way. You will work on wafer bonding measurements and combine these with advanced
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to recycle. Thermoplastic composite (TPC) components, instead, can be produced rapidly and recycled relatively easily. The major challenge, however, is in scaling up both the series size and the physical
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Join TU Delft to uncover the biology of cellular robustness in an industrial yeast process and translate your discoveries into innovative genome engineering strategies. Job description You will join
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Vacancies Post-doctoral position in Experimental Analysis and Control of Induction Welding Process for Thermoplastic Composites of Thermoplastic Manufacturing Process Key takeaways The challenge
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nucleation pathways related to different emissions characteristics at the engine exhaust. The collected data would be helpful to validate the microphysics models for ice nucleation process, hence clarifying
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You will develop new theoretical methods for quantum sensing with mechanical systems, explore their use in tests of fundamental physics, and help build the research environment of a new theory group
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data would be helpful to validate the microphysics models for ice nucleation process, hence clarifying the different nucleation pathways for ice formation. You will collaborate with other researchers
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Are you interested in (re)entering biotech research? This position supports a non-linear career path with a focus on implementing process analytical technology into bioprocesses. Job description