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and professional development. For more information, please visit Working at Utrecht University . Selection process At Utrecht University, we strive to be a place where everyone feels at home. We value
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and inclusion. external link If you have any questions about accessibility, for example regarding your workplace Sjoerd Groenmangebouw external link , the application process or your work, please
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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online. We will not process applications sent by email and/or post. As part of knowledge security, TU Delft conducts a risk assessment during the recruitment of personnel. We do this, among other things
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conventional and green steels. Where experimental work within the project focuses on process development and validation, this position addresses the underlying governing atomistic mechanisms. Within
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from mathematics, information science, astronomy, physics, chemistry and bio-pharmaceutical sciences to biology and environmental sciences. The research activities are organised in eight institutes
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, Information & Computing Sciences, Physics, Chemistry and Mathematics. Together, we work on excellent research and inspiring education. We do so, driven by curiosity and supported by outstanding infrastructure
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publications in scientific literature. Where to apply Website https://www.academictransfer.com/en/jobs/362348/postdoctoral-researcher-fluores… Requirements Specific Requirements A PhD in physics, environmental
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96 hours. End-of-year bonus of 8.3% and 8% holiday allowance. Extensive opportunities for personal and professional development. Selection process Interested? Does this vacancy appeal to you? If so
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requirements and working prototypes Affinity with multidisciplinary collaboration, including working with machine learning researchers and sports or movement scientists Affinity with sports, physical activity