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identify the optimal foaming process parameters and study the effects of additives such as starch, silica and calcium carbonate on thermal, mechanical and water-related properties. They will also be
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, Sputtering or MOCVD systems for microelectronics and emerging sensor technologies. Key Responsibilities: Develop and optimize wafer-scale 2D materials, including TMDCs, MXenes, and MOFs, for microelectronics
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