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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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of neural networks, information-theoretic and optimal-transport perspectives on representation and generalisation, probabilistic numerics and Bayesian deep learning, and emerging frameworks for scientific
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process execution (e.g., identifying concept drift), simulation of highly variable processes, optimization of variable workflows, and many related challenges. Information In the Department of Mathematics
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biochar application in composting. Your work will include the optimization of biochar production from different biomass types at different pyrolysis conditions to produce biochar with characteristics
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optimal decision-making. This post-doctoral researcher position is part of TUNED (TUnnelontwerp en engineering voor een geologische eindberging in kleilagen in NEDerland), a 4-year research project bringing
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developments, you will work closely with the other PhD, postdocs, engineers in the lab, and other collaborators from TUM and ETH, to establish a digital twin for construction, and optimize CAML hardware
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systems can coordinate “cue” satellites by determining the optimal response: identifying which satellites should be tasked, when observations should occur, and which asset can capture the event first. This
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, aerial robotics, robotic manipulation, optimal control, robot learning, or human-robot interaction. Experience with developing planning, control, or coordination algorithms for robotic systems, preferably
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optimal ways to schematize and parameterize the subsurface at local to regional scales to assess dike safety using geological and geohydrological data and models, for characteristic fluvial landscapes in
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applications. This includes, but is not limited to, stochastic differential equations, stochastic partial differential equations, variational and geometric methods, probabilistic numeric, optimal transport, and