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of heterogeneous integration and advanced device transfer technologies. Information Photonic integrated circuits - or optical chips - have evolved into a mature technology with a broad spectrum of use cases and a
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18 Sep 2026 Job Information Organisation/Company ARCNL Research Field Engineering » Chemical engineering Engineering » Mechanical engineering Physics » Applied physics Physics » Thermodynamics
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of Electrical Engineering at TU/e. Within QTS you will work within a dynamic team of approximately thirty researchers and as part of ECO will be part of one of the leading groups on optical communications and
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simulation/computing team! We pioneer methods to manipulate individual strontium atoms in optical tweezers [Phys. Rev. Research 4 , 023245 (2022) , SciPost Phys. 19 , 118 (2025) , arXiv:2512.14611 (2025
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engineering or applied physics. Demonstrated ability to conduct research in experimental fluid mechanics. Proven competence on flow measurement techniques and PIV. Familiarity with optics, lasers, image
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of educational backgrounds, ranging from microbial physiology and bioprocess engineering to applied optics and data science. Non-linear career path funding This one-year position is funded with
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(there is room for learning-on-the-job). A PhD in aerospace/mechanical engineering or applied physics. Demonstrated ability to conduct research in experimental fluid mechanics. Proven competence on flow
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attention and cognitive processing. You will work in a multidisciplinary team using cutting-edge experimental methods, including eye tracking, pupillometry and behavioural paradigms, to advance our
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2 Jul 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Materials engineering Physics » Optics Physics » Solid state physics Researcher
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked