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required. Main Tasks and responsibilities: Development and optimization of electrochemical biosensors and nanomaterial-based sensing platforms. Functionalization of sensor surfaces with bioreceptors
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and responsibilities: The researcher will be in charge of supporting the development and optimization of nanomaterial-based biosensing platforms for biomedical applications. The researcher will
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assessment tool that computes SOT efficiencies through autonomous numerical modelling and quantum transport simulations, and COMPASS, an evolutionary optimiser that proposes new candidate heterostructures
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sheets and amorphous graphene nanoribbons generated by collaborating teams at University of Ankara. They will be trained in the LSQUANT methodology and in the numerical tools developed at ICN2 to simulate
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required. Main Tasks and responsibilities: The researcher will be in charge of supporting the development and optimization of nanomaterial-based biosensing platforms for biomedical applications
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insights to help optimize device performance. Additionally, you will support collaborators by assisting with in-situ TEM measurements, facilitating cutting-edge research in sustainability and energy fields
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supporting the fabrication of high-quality nanodevices in cleanroom facilities. Main Tasks and responsibilities: 1) Support the design, assembly, maintenance, and optimization of experimental setups
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Research Engineer - Tools developer for LSQUANT platform (Theoretical and Computational Nanoscience)
of Group/Project: The TCN group is launching an activity on marrying Artificial Intelligence with its activities and numerical tools to access charge transport information in complex (disordered) van der
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valuable insights to help optimize device performance. Additionally, you will support collaborators by assisting with in-situ TEM measurements, facilitating cutting-edge research in sustainability and energy
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bonding rigid structures such as ASICs onto flexible polyimide-based thin-film devices. The candidate will contribute both to the development and optimization of bonding approaches for ASIC-integrated thin