Sort by
Refine Your Search
-
Listed
-
Category
-
Country
-
Program
-
Employer
- City University of Hong Kong
- UNIVERSITY OF MACAU
- Princeton University
- Fraunhofer-Gesellschaft
- National University of Science and Technology POLITEHNICA Bucharest
- ;
- NIST
- Delft University of Technology (TU Delft)
- North Carolina State University
- Argonne
- Nanyang Technological University
- University of Texas at Austin
- National University of Singapore
- CNRS
- Rochester Institute of Technology
- University of Utah
- Arizona State University
- Pennsylvania State University
- Purdue University
- University of California
- University of Southern California
- City University of Hong Kong (Dongguan)
- National Hellenic Research Foundation
- Oak Ridge National Laboratory
- SINGAPORE INSTITUTE OF TECHNOLOGY (SIT)
- THE UNIVERSITY OF HONG KONG
- University of California, Merced
- University of Florida
- University of Sheffield
- University of Sheffield;
- AALTO UNIVERSITY
- Aalborg University
- Boise State University
- City University of Hong Kong (Donguan)
- DAAD
- ETH Zurich
- ETH Zürich
- European Space Agency
- Ghent University Global Campus
- Grenoble INP - Institute of Engineering
- Indiana University
- Iowa State University
- King Abdullah University of Science and Technology
- Montanuniversität Leoben
- Poznan University of Technology
- Rutgers University
- Shenzhen University of Advanced Technology
- Technical University of Munich
- Texas A&M University System
- UNIVERSIDAD POLITECNICA DE MADRID
- University of Glasgow
- University of Illinois at Urbana Champaign
- University of Macau (UM)
- University of Zagreb, Faculty of Electrical Engineering and Computing
- Łukasiewicz Research Network - Institute of Microelectronics and Photonics
- Brown University
- Brown University School of Engineering
- CNRS IEMN
- CNRS-LIRMM
- Chapman University
- ESRF - European Synchrotron Radiation Facility
- Foundation for Research and Technology
- George Mason University
- Georgia Southern University
- Great Bay University
- Harvard University
- Helmholtz Association of German Research Centres
- Helmholtz Zentrum München - Deutsches Forschungszentrum für Gesundheit und Umwelt
- Huazhong Agricultural University (HZAU)
- IMEC
- INSA Strasbourg
- Instituto de Telecomunicações
- King's College London
- Laboratory of Computer Science, Robotics and Microelectronics of Montpellier (LIRMM) and Alternative Energies and Atomic Energy Commission (CEA)
- Lulea University of Technology
- Luleå University of Technology
- MOHAMMED VI POLYTECHNIC UNIVERSITY
- Marquette University
- Massachusetts Institute of Technology
- Max Planck Institute for Solar System Research, Göttingen
- McGill University
- SUNY University at Buffalo
- THE HONG KONG POLYTECHNIC UNIVERSITY
- Technical University of Denmark;
- Temple University
- The Chinese University of Hong Kong
- UNINOVA - Instituto de Desenvolvimento de Novas Tecnologias
- Universidad Carlos III de Madrid
- University College Cork
- University College Dublin
- University of Bath
- University of Bremen •
- University of British Columbia
- University of California Los Angeles
- University of Connecticut
- University of Copenhagen
- University of Delaware
- University of Liverpool
- University of Michigan
- University of Minho
- 90 more »
- « less
-
Field
-
15 Jul 2026 Job Information Organisation/Company University of Zagreb, Faculty of Electrical Engineering and Computing Department Department of Electronics, Microelectronics, Computer and
-
Job Posting Title: Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center ---- Hiring Department: Office of the Vice President for Research ---- Position
-
Job description: The School of Electrical and Electronic Engineering seeks to appoint a Lecturer (equivalent to Assistant Professor) in Microelectronic Systems Design and Implementation, with
-
Overview The School of Electrical and Electronic Engineering seeks to appoint a Lecturer (equivalent to Assistant Professor) in Microelectronic Systems Design and Implementation, with specific
-
to develop advanced technologies in the field of microelectronics, particularly for automotive applications. The project focuses on the design, development and testing of innovative electronic structures based
-
Engineering Director for the Centre for Heterogeneous Integrated MicroElectronic and Semiconductor..
The Engineering Director for the Centre for Heterogeneous Integrated MicroElectronic and Semiconductor Systems (CHIMES2) is responsible for leading, building and mentoring a world-class
-
RAP opportunity at National Institute of Standards and Technology NIST Microwave Materials for High-Speed Microelectronics Location Communications Technology Laboratory, Radio Frequency
-
The Center for Nanoscale Materials (CNM) at Argonne National Laboratory seeks an outstanding postdoctoral researcher to advance data-driven, physics-informed AI for microelectronics materials
-
MultiPhysics Measurements and Modeling for Microelectronics at Microwave and mm-Wave Frequencies NIST only participates in the February and August reviews. Performance, security, and reliability
-
Postdoctoral Research Associate- AI/ML Accelerated Theory Modeling & Simulation for Microelectronics
length/time scales, to provide improved mechanistic insights into nanomaterials response. Bulk of the work will be on novel materials for next-generation microelectronic devices (e.g. oxide ferroelectrics