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Engineering, Mechanical Engineering, Microelectronics, Chemistry, or a related discipline. Demonstrated research experience in flexible/stretchable electronics interconnection, printed electronics, conductive
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, Materials Science, Applied Physics, or related field Experience in high-reliability microelectronics Familiar with micro-fabrication techniques and semiconductor processing Experience in conducting electrical
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, Robotics, Microelectronics Engineering or a related discipline. Knowledge, research experience or demonstrated interest in one or more of the following areas: Robotic grippers and robotic manipulation
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at the bio-electronics interface. Through electronic material development and nano/microfabrication innovation, we will develop next-generation electronic materials and microelectronics that mimic
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Engineering, Microelectronics, Chemistry, or a related discipline. Demonstrated research experience in diffusion bonding, brazing, soldering, interfacial joining, or low-temperature bonding of advanced
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/ Microelectronics/ EEE/ or related. Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid bonding; litho/etch/CMP/plasma/anneal). Characterization: optical/profilometry, SEM/TEM