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will contribute to an industry-sponsored project focused on the integration of energetic materials with microelectronic devices through advanced printing technologies. The successful candidate will lead
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areas: electronics and microelectronics optical systems and lasers ultrasound or sensor technologies precision instrumentation mechanical design and CAD biomedical imaging systems Programming experience
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, Sputtering or MOCVD systems for microelectronics and emerging sensor technologies. Key Responsibilities: Develop and optimize wafer-scale 2D materials, including TMDCs, MXenes, and MOFs, for microelectronics
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Position Description PART 01 Introduction of the project group Relying on mathematics, quantum computing, computer, microelectronics and other disciplines, Center for Network and Information