Sort by
Refine Your Search
-
Category
-
Country
-
Program
-
Employer
- City University of Hong Kong
- UNIVERSITY OF MACAU
- ;
- CNRS
- Delft University of Technology (TU Delft)
- Indiana University
- Rochester Institute of Technology
- University of Utah
- Arizona State University
- City University of Hong Kong (Dongguan)
- Fraunhofer-Gesellschaft
- Oak Ridge National Laboratory
- THE UNIVERSITY OF HONG KONG
- AALTO UNIVERSITY
- City University of Hong Kong (Donguan)
- DAAD
- Ghent University Global Campus
- Iowa State University
- Montanuniversität Leoben
- NIST
- Shenzhen University of Advanced Technology
- University of Sheffield
- University of Sheffield;
- University of Southern California
- Aalborg University
- Argonne
- CNRS-LIRMM
- George Mason University
- Great Bay University
- Helmholtz Association of German Research Centres
- Helmholtz Zentrum München - Deutsches Forschungszentrum für Gesundheit und Umwelt
- INSA Strasbourg
- Instituto de Telecomunicações
- Laboratory of Computer Science, Robotics and Microelectronics of Montpellier (LIRMM) and Alternative Energies and Atomic Energy Commission (CEA)
- Lulea University of Technology
- Luleå University of Technology
- Princeton University
- Rutgers University
- THE HONG KONG POLYTECHNIC UNIVERSITY
- Technical University of Munich
- Texas A&M University System
- UNINOVA - Instituto de Desenvolvimento de Novas Tecnologias
- University of Bremen •
- University of British Columbia
- University of Delaware
- University of Glasgow
- University of Illinois at Urbana Champaign
- University of Macau (UM)
- University of Minho
- University of Oldenburg •
- Uppsala universitet
- https://engineering.ok.ubc.ca/
- 42 more »
- « less
-
Field
-
innovation and knowledge transfer. Disciplines: Electronic and Information Engineering Computer and Data Engineering Electronic and Electrical Engineering Information Engineering Microelectronics Engineering
-
Scientific exchange and presentation of research results at conferences and participation in workshops What you contribute Completed university degree (master's/diploma) in microelectronics, materials science
-
research activities and have access to state-of-the-art facilities, such as the NanoFab microelectronics fabrication space on the ASU Tempe campus and the MacroTechnology Works facility, a former
-
Location Physical Measurement Laboratory, Radiation Physics Division opportunity location 50.68.21.C0315 Gaithersburg, MD NIST only participates in the February and August reviews. Advisers name email phone
-
of three State Key Laboratories in microelectronics, Chinese medical sciences, and internet of things for smart city. To support economic diversification of MSAR and deepen collaboration between MSAR and
-
or equivalent Specific Requirements Any national, foreign and stateless candidate(s) holding a doctorate degree in Electrical/Electronic Engineering, Telecommunications, Photonics, Microelectronics, Physics
-
engineering bio-statistics and AI-healthcare smart/semi-conductor manufacturing AI/robotics/autonomous systems aerospace and microelectronics engineering energy generation and storage digital business and
-
foreseen in article 5º of the Research Fellow Statutes and applicable regulations. Selection panel: The selection panel is composed by: President: Doctor Luís Miguel Valente Gonçalves (Associate Professor
-
engineering bio-statistics and AI-healthcare smart/semi-conductor manufacturing AI/robotics/autonomous systems aerospace and microelectronics engineering energy generation and storage digital business and
-
performance and other relevant materials properties. The research will take place in the Electronic Components, Technology and Materials section of the Microelectronics Department. Within the consortium, also