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. The successful candidate will contribute to cutting-edge research in the modeling, design, fabrication, characterization, and system integration of MEMS quartz resonators for next-generation precision micro
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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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