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and advanced manufacturing, Brainport is a place where technology serves people and society. Learn more about the Brainport region here . The Department of Mechanical Engineering department conducts
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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degree in Mechanical Engineering or related field. Experience in experimental study of mechanical processing Hands on experince in practical engineering and process design A critical attitude towards
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braking energy, smart energy management; b) mobile charging solutions for zero-emission construction machinery using the trolleybus network as an energy source. This Postdoc is part of the EU-funded
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construction machinery using the trolleybus network as an energy source. This Postdoc is part of the EU-funded GRID4CITY project, within the Driving Urban Transitions (DUT) Partnerships program call 2025-26
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. The Faculty of CEG comprises 28 research groups in the following seven departments: Materials Mechanics Management & Design, Engineering Structures, Geoscience and Engineering, Geoscience and Remote Sensing
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A vacancy is available for a Postdoc in the field of electrocarboxylation of furan derivatives at the Department of Chemical Engineering and Chemistry, Eindhoven University of Technology (TU/e), The
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will investigate whether these interactions can be exploited to create a new MR contrast mechanism that is particularly sensitive to microscopic susceptibility-induced field variations, such as those
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, physics, applied mathematics, engineering, computer science or related discipline. Strong skills in fluid mechanics and numerical modelling. Experience with large observational data sets of environmental
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-based motility, combining engineered bacterial systems displaying IcsA or ActA with purified host actin-regulatory proteins. Using fluorescence microscopy, the postdoc will quantify actin-tail formation