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, scenarios and datasets that will serve the consortium, external academic users and industry for the coming decade. TU Delft is recruiting two postdocs to lay its foundations. This vacancy focuses on detailed
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Are you fascinated by atomic-scale control of materials for future semiconductor and energy technologies? We are looking for three ambitious postdocs to work on advanced atomic layer processing
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1 Oct 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Materials engineering Engineering » Nuclear engineering Researcher Profile
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groups in the following seven departments: Materials Mechanics Management & Design, Engineering Structures, Geoscience and Engineering, Geoscience and Remote Sensing, Transport & Planning, Hydraulic
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collaboration strategies, business models and incentives from ships, terminals and logistics-ecosystem perspectives. The Postdoc will join the Department of Maritime and Transport Technology and will have the
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18 Sep 2026 Job Information Organisation/Company University of Twente (UT) Research Field Engineering » Materials engineering Engineering » Mechanical engineering Researcher Profile Recognised
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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chemical engineering, physical chemistry, materials science, or a closely related field. You have hands-on experience with building experimental setups, ideally involving flow synthesis and experimental
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for the commercialisation of the technology in the near future is a thorough understanding and modelling of the corrosion chemistry of the molten salt nuclear fuel in contact with structural materials in the reactor core
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engineered composite materials with various types of polymers and precious metals that are difficult to recycle. Thus, after used, cardiac catheters are usually incinerated, resulting in significant material