Lead Microfabrication Process Engineer

Details

Posted: 10-Apr-24

Location: La Jolla, California

Salary: Open

Categories:

Other Staff/Administrative
Staff/Administrative

Internal Number: 126860

UCSD Layoff from Career Appointment: Apply by 11/29/23 for consideration with preference for rehire. All layoff applicants should contact their Employment Advisor.

Special Selection Applicants: Apply by 12/11/23. Eligible Special Selection clients should contact their Disability Counselor for assistance.

Job posting will remain open until a suitable candidate has been identified.

DESCRIPTION

Working closely with faculty members, Nano3 staff members, postdoctoral researchers, and other team members, the lead process engineer's major responsibilities are to develop advanced micro- and nano- fabrication techniques and processes for the realizations of heterogeneous 2.5D/3D integration and for enhanced CMOS for 5G/6G applications. Examples of heterogeneous 2.5D/3D integration techniques and processes to be developed include chip stacking, vias fabrication (TSV), 3D multi-wafers, multi-layers integration, wafer bonding and pick-and-place. Examples of enhanced CMOS techniques and processes include depositions of heterogeneous materials, such as, quantum dots, metals, oxides, 2D material, magnetic materials, piezoelectric materials, on partially processed CMOS wafers or devices. The process engineer will also work closely with the EDA (Electronic Design Automation) provider to demonstrate the process capabilities and fabricate device prototypes using techniques such as photo- and electron-beam patterning, wet/dry-etching, materials deposition, metrology, materials analysis, soft-lithography and more.

The process engineer will also be responsible for understanding and executing the process development strategic plans, refining the techniques, documenting all the process details, and transferring the techniques to different stakeholders. Using skills as a seasoned, experienced engineering professional in a specialized engineering field on a major training and / or research effort, the process engineer will:

(1) Develops and characterizes multiple fabrication/characterization processes for heterogeneous 2.5D/3D integration and enhanced CMOS. Fabricate micro/nano-structured devices for demonstrations of the above mentioned processes. Nanofabrication processes to be developed, includes but not limited to: optical and electron-beam lithography, etching, materials deposition, imprint lithography, hot-embossing, micro- machining, molding, bonding, and metrology.

(2) Develops innovative technologies for realizations and optimizations of the above mentioned processes, and transfer of such technologies to stakeholders, industrial Fab representatives, or users with diverse backgrounds.

(3) Develops protocols with EDA providers to facilitate the automation of process monitoring and optimizations.

(4) Documents all process details in a professional way that can be transferred to different stakeholders and industrial partners.

(5) Provides training to users with diverse backgrounds and improves educational and outreach programs where users are trained in micro/nano fabrication to design, fabricate and test micro-meter scale devices across many areas of the microtechnology.

(6) Designs and develops novel capabilities of existing and new nano/micro-fabrication equipment. Operate and maintain Nano3's existing fabrication equipment, install and operate future nano/micro-fabrication and characterization equipment, and new user training on existing and future nano/micro-fabrication equipment.

(7) Serves as technical resource and liaison to researchers, staff and industry partners for development of designs/experiments, proactively finding solutions to complex problems. Additional tasks include provision of direct services to internal and external users of the facility, including, but not limited to, fabrication of micro/nano-dimensional devices, electron-beam lithography patterning, nano/micro-molds preparation, and equivalent responsibilities as future equipment becomes available.

Responsible for the Day-to-day operations and fabrication. Work has considerable impact on projects and ability to meet unit/department goals and is reviewed in terms of meeting objectives.

QUALIFICATIONS

• Master's degree in an engineering field with six (6) years of relevant experience in micro/nano fabrication process development, or an equivalent combination of education/experience/training required.

• Strong demonstrated knowledge of and experience in engineering principles and methods to independently perform the full range of engineering professional design work.

• Demonstrated working knowledge of analysis techniques, including but not limited to: Scanning electron microscopy, Scanning probe microscopy, Contact profilometry, 3-D optical profilometry, Film stress measurement, ellipso

  
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