Wire Bonding and Interconnection Technical Engineer (EP-DT-DD-2021-90-LD)

Introduction

Are you a Wire Bonding and Interconnection Technical Engineer with experience in ultrasonic Aluminium wedge wire bonding as well as an interest in micro-connectivity and packaging of electronics and complex particle detector systems? Then seize the opportunity and join the Detector Technology group operating at the heart of CERN Experimental Physics Department. Within our team, you will contribute to the development and construction of leading-edge technical solutions for the next generation of particle detectors. Take part!

You will join:

• The Experimental Physics (EP) Department which carries out basic research in the field of experimental particle physics in a stimulating scientific atmosphere, standing as an important reference for the European physics community. It also contributes to the education and training of young scientists.
• The Detector Technologies (DT) group which is in charge of the development, construction, operation and maintenance of many particle detectors and their technical infrastructure for the different experiments at CERN.
• The Detector Development (DD) section provides expertise in various fields of detector technologies. It also comprises the operation of several facilities for detector R&D, such as the Wire Bonding and Interconnect facility and the Quality and Reliability Assurance lab, dedicated laboratories for the characterization of semiconductor and gaseous detectors, and it operates the EP irradiation facilities.

EP-DT Website: http://ep-dep-dt.web.cern.c

Functions

As Wire Bonding and Interconnection Technical Engineer in the Detector Development Section, you will be responsible for providing wire bonding for a diverse clientele from all experiments as well as different projects at CERN. Together with the Bondlab manager you will ensure timely completion of the requests and provide feed-back as well as advice to the clients. You will support new requests with your expert knowledge to achieve optimized connections and help to develop new concepts in the field of interconnections. Furthermore, you will be part of the daily operation of the lab and contribute to the maintenance and operation of equipment and infrastructure.

The Bondlab provides a service that includes mounting of electronics and solid-state detectors on printed circuit boards and flexible printed circuit boards and their connection using ultra-sonic aluminium wedge wire bonding using state of the art automatic bonding machines. Work requests range from R&D projects to small and medium size productions with several hundred pieces. The Bondlab is located in a class 7 cleanroom and is equipped with automatic wire bonding machines, pull tester, several inspection microscopes, pick and place machines as well as other auxiliary equipment. The Bondlab also provides expert advice for new projects for all matters related to connectivity of chips and particle detectors and participates together with the neighbouring QARTlab in reliability tests.

You will:

• Provide service offered by the Bondlab, including Aluminium wedge wire bonding of electronic chips and solid-state detectors, mounting of components and related activities, including pull testing, visual inspection and reliability testing;
• Interact with clients, execute the work requests in consultation with the Bondlab manager, provide feed-back and information for the clients, prepare documentation;
• Support projects in new developments with expert advice on conception of electronic chip connections and card design and participate in the study of new interconnection technologies, exchange information with outside Bonding experts and liaise with equipment suppliers;
• Work on the conception and design of mechanical support structures for wire bonding and related activities of the Bondlab;
• Take care of the optimum functioning of the equipment, ensure daily operation of the Bondlab, contribute to the maintenance, order lab supplies and equipment and help maintaining the inventory.