PhD Research Fellow in Applied Micro- and Nanosystems

Updated: over 2 years ago
Job Type: FullTime
Deadline: 04 Oct 2021

The Faculty of Technology, Natural Sciences and Maritime Sciences has a vacancy for a position as PhD Research Fellow in Applied Micro- and Nanosystems from 01.11.2021.

The position is associated with the Department of Microsystems and reports to the Head of Department. The place of employment is Campus Vestfold in Horten, Norway.

Appointment is for a period of three years. The position does not include teaching duties, and there is a premise for employment that the PhD Research Fellow is enrolled in USN’s PhD-program in Applied Micro- and Nanosystems within three months of accession in the position.

Packaging of microelectromechanical systems (MEMS) is important to ensure optimal performance and reliability of the devices. This research project focuses on various approaches for hermetic sealing of MEMS devices. The process includes (i) design and microfabrication of caps/lids to enhance the performance of specific devices, (ii) evaluation of various bonding/sealing techniques, and (iii) characterization of hermeticity, integrity and reliability of the sealed packages. Wafer-level packaging has emerged as a potential approach for mass production of MEMS devices at a lower cost, as compared with die-level packaging.

The research of the PhD fellow will cover the entire process for hermetic sealing of MEMS devices with particular interest on low-temperature bonding/sealing methods. Reducing bonding temperature is beneficial for hermetic sealing process in terms of increasing yield, reducing stress induced in the wafer packages, minimalizing impact on MEMS devices and (in some cases) its integrated electronics. The potential bonding method includes various metallic bonding techniques: Primarily solid-liquid interdiffusion (SLID) and secondarily thermocompression bonding. Both these techniques allow a lower process temperature while the resulting bonds are robust to higher temperatures. These bonding techniques are used for die attach and for electrical interconnection, as well as for hermetic sealing. A variety of metal systems are relevant.

The PhD fellow will be supported by a larger research team working on packaging solutions for new MEMS-based microbolometer arrays used in infrared thermal imaging systems. The team consists of professors, postdoctoral and PhD fellows, in addition to industrial partners.

The successful candidate will be a member of the research group “Materials and Micro-integration” at Department of Microsystems. The group has long experience with packaging technologies including materials, assembly, integration, characterization and testing. The group has substantial collaboration with industrial partners in Norway as well as international partners.



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