Postdoc Scaling Interconnects for Ultra High-Throughout Chip Assembly

Scaling interconnects for ultra high-throughout chip assembly.

Current assembly processes utilize high-speed robotic systems to pick, place and bond microelectronic components at the right position. Aggressive downscaling of the size of the components supporting forthcoming applications requires corresponding updates in size, composition and fabrication of their interconnects. In this project we work on novel interconnect technology to enable reliable ultra high-troughput assembly of microcomponents.

We look for a post-doctoral researcher that will investigate the scaling behavior of interconnects. Challenges include the identification of suitable metallurgy, the reproducible fabrication of the interconnects, and modeling of their properties. The results of the project are expected to lead a new machine that will revolutionize current assembly processes, reducing their cost and environmental impact. You will collaborate with both academic and industrial scientists and engineers, and benefit from prior insight to develop the new technology.

As a postdoc you will be involved in the design, fabrication and characterization of the novel interconnects, while also contributing to building fundamental understanding in their scaling behavior. You will closely collaborate with 1 PhD student. The work is expected to result in multiple scientific publications. 

You will be part of a team of 5 PhD and 3 postdoc researchers, who work together with staff scientists and engineers at TU Delft and from industry. Each of the researchers will work on a dedicated part of the project, while at the same time closely collaborating with the rest of the team to ensure all parts can eventually fit together to realize all steps that need to be performed in the chip-assembly process.

Candidates have PhD degree in electrical engineering, mechanical engineering, micro/nano engineering, physics or related fields. We are looking for candidates who can realize creative new solutions for dealing with the diverse challenges that accompany the accurate, fast and reliable assembly of microchips, involving skills like experimental design, modeling, setup realization, use of (high-speed) vision systems and material characterization techniques.

The collaboration both with a team of fellow researchers, and with a high-tech company that is a world leader in its business, will give you the unique opportunity to learn a lot and contribute to the next generation of machines that will improve the assembly speed and reduce the environmental impact of the production of hundreds of billions of future chips.

We are looking for a candidate that:

• Has a PhD degree in mechanical engineering, physics, electrical engineering or related fields.
• Has experience and/or affinity with microelectronic packaging and/or reliability.
• Likes to design and fabricate microsystems, and characterize their behavior.
• Comes up with creative new solutions for dealing with the diverse challenges that accompany the accurate, fast and reliable assembly of microcomponents.
• Writes and contributes to scientific publications.
• Is a team player that likes to collaborate with colleagues from university and industry.
• Contributes to the supervision of PhD and MSc. students in the project.
• Is enthousiastic to work on exciting, ground-breaking technology with the aim to revolutionize future chip production methods.

Salary and benefits are in accordance with the Collective Labour Agreement for Dutch Universities.The TU Delft offers a customisable compensation package, discounts on health insurance, and a monthly work costs contribution. Flexible work schedules can be arranged.

For international applicants, TU Delft has the Coming to Delft Service . This service provides information for new international employees to help you prepare the relocation and to settle in the Netherlands. The Coming to Delft Service offers a Dual Career Programme  for partners and they organise events to expand your (social) network.

Delft University of Technology is built on strong foundations. As creators of the world-famous Dutch waterworks and pioneers in biotech, TU Delft is a top international university combining science, engineering and design. It delivers world class results in education, research and innovation to address challenges in the areas of energy, climate, mobility, health and digital society. For generations, our engineers have proven to be entrepreneurial problem-solvers, both in business and in a social context.

At TU Delft we embrace diversity as one of our core values  and we actively engage  to be a university where you feel at home and can flourish. We value different perspectives and qualities. We believe this makes our work more innovative, the TU Delft community more vibrant and the world more just. Together, we imagine, invent and create solutions using technology to have a positive impact on a global scale. That is why we invite you to apply. Your application will receive fair consideration.

Challenge. Change. Impact!

The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force behind the technology we all use in our daily lives. Technology such as the electricity grid, which our faculty is helping to make completely sustainable and future-proof. At the same time, we are developing the chips and sensors of the future, whilst also setting the foundations for the software technologies to run on this new generation of equipment – which of course includes AI. Meanwhile we are pushing the limits of applied mathematics, for example mapping out disease processes using single cell data, and using mathematics to simulate gigantic ash plumes after a volcanic eruption. In other words: there is plenty of room at the faculty for ground-breaking research. We educate innovative engineers and have excellent labs and facilities that underline our strong international position. In total, more than 1000 employees and 4,000 students work and study in this innovative environment.

Click here  to go to the website of the Faculty of Electrical Engineering, Mathematics and Computer Science.

 For more information about this vacancy, please contact dr. Massimo Mastrangeli, [email protected] .

Are you interested in this vacancy? Please apply no later than April 30, 2024 via the application button and upload your CV and letter of motivation in which you outline your interest and suitability for this position. If possible, include relevant grades or other indicators of your relevant skills and suitability for this project, like written work, projects, hobbies or awards.

Please note:

• A pre-employment screening can be part of the selection procedure.
• You can apply online. We will not process applications sent by email and/or post.
• Please do not contact us for unsolicited services.