Postdoc Scaling Interconnects for Ultra High-Throughout Chip Assembly

1 Mar 2024
Job Information

Organisation/Company

Delft University of Technology (TU Delft)

Research Field

Technology

Researcher Profile

Recognised Researcher (R2)

Country

Netherlands

Application Deadline

30 Apr 2024 - 21:59 (UTC)

Type of Contract

Temporary

Job Status

Not Applicable

Hours Per Week

40.0

Is the job funded through the EU Research Framework Programme?

Not funded by an EU programme

Is the Job related to staff position within a Research Infrastructure?

No

Offer Description

Current assembly processes utilize high-speed robotic systems to pick, place and bond microelectronic components at the right position. Aggressive downscaling of the size of the components supporting forthcoming applications requires corresponding updates in size, composition and fabrication of their interconnects. In this project we work on novel interconnect technology to enable reliable ultra high-troughput assembly of microcomponents.

We look for a post-doctoral researcher that will investigate the scaling behavior of interconnects. Challenges include the identification of suitable metallurgy, the reproducible fabrication of the interconnects, and modeling of their properties. The results of the project are expected to lead a new machine that will revolutionize current assembly processes, reducing their cost and environmental impact. You will collaborate with both academic and industrial scientists and engineers, and benefit from prior insight to develop the new technology.

As a postdoc you will be involved in the design, fabrication and characterization of the novel interconnects, while also contributing to building fundamental understanding in their scaling behavior. You will closely collaborate with 1 PhD student. The work is expected to result in multiple scientific publications.

Requirements
Specific Requirements

You will be part of a team of 5 PhD and 3 postdoc researchers, who work together with staff scientists and engineers at TU Delft and from industry. Each of the researchers will work on a dedicated part of the project, while at the same time closely collaborating with the rest of the team to ensure all parts can eventually fit together to realize all steps that need to be performed in the chip-assembly process.

Candidates have PhD degree in electrical engineering, mechanical engineering, micro/nano engineering, physics or related fields. We are looking for candidates who can realize creative new solutions for dealing with the diverse challenges that accompany the accurate, fast and reliable assembly of microchips, involving skills like experimental design, modeling, setup realization, use of (high-speed) vision systems and material characterization techniques.

The collaboration both with a team of fellow researchers, and with a high-tech company that is a world leader in its business, will give you the unique opportunity to learn a lot and contribute to the next generation of machines that will improve the assembly speed and reduce the environmental impact of the production of hundreds of billions of future chips.

We are looking for a candidate that:

• Has a PhD degree in mechanical engineering, physics, electrical engineering or related fields.
• Has experience and/or affinity with microelectronic packaging and/or reliability.
• Likes to design and fabricate microsystems, and characterize their behavior.
• Comes up with creative new solutions for dealing with the diverse challenges that accompany the accurate, fast and reliable assembly of microcomponents.
• Writes and contributes to scientific publications.
• Is a team player that likes to collaborate with colleagues from university and industry.
• Contributes to the supervision of PhD and MSc. students in the project.
• Is enthousiastic to work on exciting, ground-breaking technology with the aim to revolutionize future chip production methods.

Additional Information
Benefits

Salary and benefits are in accordance with the Collective Labour Agreement for Dutch Universities. The TU Delft offers a customisable compensation package, discounts on health insurance, and a monthly work costs contribution. Flexible work schedules can be arranged.

For international applicants, TU Delft has the Coming to Delft Service . This service provides information for new international employees to help you prepare the relocation and to settle in the Netherlands. The Coming to Delft Service offers a Dual Career Programme for partners and they organise events to expand your (social) network.

Selection process

Are you interested in this vacancy? Please apply no later than April 30, 2024 via the application button and upload your CV and letter of motivation in which you outline your interest and suitability for this position. If possible, include relevant grades or other indicators of your relevant skills and suitability for this project, like written work, projects, hobbies or awards.

Please note:

• A pre-employment screening can be part of the selection procedure.
• You can apply online. We will not process applications sent by email and/or post.
• Please do not contact us for unsolicited services.

Additional comments

For more information about this vacancy, please contact dr. Massimo Mastrangeli, [email protected] .

Website for additional job details

https://www.academictransfer.com/338453/

Work Location(s)

Number of offers available

1

Company/Institute

Delft University of Technology

Country

Netherlands

City

Delft

Postal Code

2628 CD

Street

Mekelweg 2

Geofield

Where to apply

Website

https://www.academictransfer.com/en/338453/postdoc-scaling-interconnects-for-ul…

Contact

City

Delft

Website

http://www.tudelft.nl/

Street

Mekelweg 2

Postal Code

2628 CD

STATUS: EXPIRED