Postdoc in computational electromagnetics for soft X-ray wafer metrology

Updated: 16 days ago
Deadline: 09 May 2021

Domain integral equations can be extremely fast solution strategies for dielectric scattering problems with a low dielectric contrast. Therefore, they are extremely fast, when computing light-scatting at EUV or soft X-ray wavelengths. This holds great potential for wafer-metrology techniques, based on light-scattering. You will be part of the LYNX research consortium, that works on developing such a metrology method. In this consortium we cooperate in a multi-disciplinary team between TU-Delft, Utrecht University, and TU Eindhoven (TU/e).

During the 18-months project, we want to start employing our EM-solver for imaging and inverse scattering, which means solving an ill-posed optimization problem. We are looking to employ automatic-differentiation techniques in the discretization of the geometry of the problem, which have a high potential for both classical and deep-learning solutions to this optimization problem.

The position is embedded in the Electromagnetics (EM) group at TU/e. The EM group focuses on engineering the behavior of electromagnetic waves for a wide range of advanced applications, from designing antennas for applications ranging from 5G and satellite communication to radio-telescopes and from health applications like MRI-safety and hyperthermia treatment to (numerical) modeling for complex and high-tech systems. Our lab, the electromagnetic and multi-physics modeling and computation (EMPMC) lab within the research group researches innovative computational methods for electromagnetics and optics. We provide ground-breaking EM modeling methods tailored to specific needs in society and industry.

The overall goal in the LYNX project, is to develop a very fast and extremely accurate wafer metrology technique to enable the next generations of semiconductor manufacturing. To control the production process of semiconductor manufacturing, a constant recalibration is required to ensure that components and connections are aligned with nanometer precision. The goal of the project is to develop metrology capabilities to monitor the production tolerances in a running production line.

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