The postdoc will be in charge of the design, fabrication, characterization of nonvolatile memory devices and circuits by advanced techniques of deposition and lithographic patterning in the clean room.
The fabrication process technology includes thin film deposition (evaporation, sputtering, ALD) and patterning via electron-beam lithography, optical lithography, reactive ion etching and lift off.
The devices will include the class of resistive/memristive memories as well as transistors and memtransistors with a channel based on metal oxide or 2D semiconductors.
The fabricated devices will then be characterized by electrical AC/DC techniques in the electrical lab. Advanced memory devices will also be deposited on CMOS-based neural networks and neurotrophic circuits to test the operation of the device at circuit level.
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