Join the advanced RF antenna & packaging team and be at the forefront of enabling next generation communication and radar applications.
What you will do
In both communication and radar applications, there is a never-ending push to mm-wave and terahertz frequencies for higher data rates, higher capacity, higher resolution and so on. At such high frequencies, several heterogeneous materials and technologies must be combined at different scales ranging from less than a micrometer up to many centimeters. To achieve the level of integration and cost/performance needed for future mm-wave products, the system architecture needs to be co-evolved together with the underlying semiconductor and passive integration technologies.
For communication and radar systems operating at frequencies above 100 GHz, we aim to combine, III-V, CMOS, waferscale packaging technologies, novel package substrates, advanced PCBs, and 3D manufacturing technologies, to achieve the best system-level trade-off between cost, performance and footprint. Optimizing the entire mm-wave electromagnetic signal path from the active devices up to free space radiation is essential to achieving this goal.
To strengthen our R&D team, we are looking for an electromagnetics expert to develop these breakthrough technologies for next generation wireless and radar applications. You will work alongside experts across multiple domains (analog and digital circuits design, device and packaging technology development, system design, etc.), in an industry-driven R&D environment.
In this job, your main tasks will be:
- Simulations of flip-chip interconnects, antenna arrays, waveguides, launchers etc.
- Modelling and simulation of passive components like inductors, filters, couplers up to sub-terahertz frequencies
- Layout and measurement of on-wafer and PCB structures, radiation pattern measurements of sub-terahertz antenna arrays
- Perform co-optimization of mm-wave packages across multiple physics domains like EM, thermal and mechanical
- Work with 3D technology experts to define technology flows where both manufacturability and EM performance are co-optimized
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