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circuits contribute to pathological aggression. The postdoc will use functional ultrasound imaging, behavioural assays, physiological recordings, computational modelling, and pathway-selective chemogenetic
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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(CML-IE) and Environmental Biology (CML-EB). Presently, about 150 fte (including postdocs and PhDs) are employed at CML. CML further collaborates with TU Delft and Erasmus University in the Leiden-Delft
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robot capabilities, dynamic constraints, contact-rich interactions, perception limitations, and high-level human guidance. A key objective is to bridge high-level task planning with the physical