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reuse are currently made across different European contexts. You will map and analyse existing decision-making processes and strategies using qualitative research methods. Based on your findings, you will
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29 Aug 2026 Job Information Organisation/Company Università degli Studi di Pavia Research Field Engineering Researcher Profile Recognised Researcher (R2) Leading Researcher (R4) First Stage Researcher (R1) Established Researcher (R3) Application Deadline 9 Sep 2026 - 12:00...
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applied to computer vision and image analysis. Analytical thinking and problem-structuring skills, including the ability to abstract complex systems, identify core research challenges, and develop
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computer vision, deep learning, and logical reconstruction techniques. The research investigates how multimodal imaging modalities - including scanning electron microscopy (SEM), photon emission microscopy
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reporter development, mechanobiology of cells within their microenvironment, and immunoengineering. Ultrasound imaging and devices, with demonstrated ability to conduct innovative, independent research and
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Chair of Biological Imaging 02.02.2026, Academic staff We are looking for a candidate (m/f/x) who will use the combination of our spectroscopy infrastructure, and structural information
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laboratory for the first time. You will make use of laser Doppler and hot-wire anemometry in the 10x5 wind tunnel (the flagship of the National Wind Tunnel Facility). You will conduct particle image
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events is desirable. Diversity Committed to equality and valuing diversity Application Process You will be required to upload a covering letter/supporting statement, CV and the details of two referees as
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Warsaw University of Technology/Centre for Advanced Materials and Technologies, CEZAMAT | Poland | about 2 months ago
" Responsibilities in the Research Team Participation in the fabrication of photonic components and semiconductor devices Development and execution of technological processes, including dry and wet etching
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research studies, data management, model development, executing experiments, and evaluating chip packaging techniques. Performs hands-on processes in chip fabrication, packaging, metrology, and