70 image-processing-phd-scholorship Postdoctoral positions at Oak Ridge National Laboratory
Sort by
Refine Your Search
-
workflows to enable AI-readiness at scale. You will work on designing system software for automating processes such as intelligent data ingestion, preservation of data/metadata relationships, and distributed
-
distributed codes using MPI, OpenMP, CUDA, ROCm, and related HPC technologies while bridging theoretical AI models with real hardware constraints. Cross‑Paradigm Integration(new optional emphasis): Explore how
-
respectful workplace – in how we treat one another, work together, and measure success. Basic Qualifications: A PhD in materials science and engineering, physics, chemistry, electrical engineering, or a
-
opportunity by fostering a respectful workplace – in how we treat one another, work together, and measure success. Basic Qualifications: A PhD in materials science and engineering or a related discipline
-
to contribute to development of alloys with desirable advances in mechanical properties, thermal/electrical properties, and processability. A background in solidification processing, high pressure die casting
-
institutional clusters. Write robust Linux bash scripts and job submission scripts for SLURM and PBS environments, including multi-node GPU/CPU workflows, monitoring, restart, and post-processing pipelines
-
respectful workplace – in how we treat one another, work together, and measure success. Basic Qualifications: A PhD in mechanical engineering, electrical engineering, or a related discipline obtained in
-
, Safety, and Service. Promote equal opportunity by fostering a respectful workplace – in how we treat one another, work together, and measure success. Basic Qualifications: A PhD degree in Mechanical
-
by fostering a respectful workplace – in how we treat one another, work together, and measure success. Basic Qualifications: A PhD in physics or a related field completed within the last 5 years
-
deformation, strengthening, and failure in advanced alloys. The research will focus on integrating microstructure characterization, in situ diffraction techniques, and mechanical testing to uncover processing