2 high-performance-computing Postdoctoral positions at University of Twente (UT)

PostDoc position on Wafer Bonding Physics for 3D Chip Integration

University of Twente (UT) | Netherlands | 12 days ago

Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip

Postdoc position in Photonic Integrated Circuit Temperature Compensation for PIC-based sensing applications

University of Twente (UT) | Netherlands | about 2 months ago

of these steps is the reduction of components, increasing the manufacturability and integration capability, while decreasing the cost price and not compromising the accuracy. For high-accuracy operation of a