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characterization of packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: • Study and development of various packaging architectures (wirebonding and embedded chip) for high
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, electric mobility, industrial electrification and modern power grids. New wide-bandgap semiconductor devices based on silicon carbide (SiC) and gallium nitride (GaN) can switch faster and reduce conversion
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Modeling: Design, train, and validate generative machine learning models (GANs, VAEs, diffusion models, and LLM-based tabular synthesizers) to generate high-fidelity synthetic tabular, longitudinal, and
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, the core scientific contribution of the SHARE project (Work Package 3). More concretely, your work will involve the following: You will design and compare deep generative approaches, UAEs, GANs, diffusion
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the subject of the call for applications, as well as the possession of a scientific-professional background suitable for carrying out the research activity covered by the contract. Where to apply Website http
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Variational Autoencoders or GANs, to efficiently analyze high-dimensional design spaces even with sparse data. Simulation setup: you create parametric geometries and build simulation chains as "virtual test
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Packaging; packaging/reliability labs; cross-layer design projects linking devices to systems. Power Electronics and Energy-Integrated Microsystems Key research areas: Power ICs; wide-bandgap (GaN/SiC
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Packaging; packaging/reliability labs; cross-layer design projects linking devices to systems. Power Electronics and Energy-Integrated Microsystems Key research areas: Power ICs; wide-bandgap (GaN/SiC
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Multiple Tenure-Track Assistant Professor Positions in Microelectronics, Circuits and Systems Design
-bandgap (GaN/SiC) integration; efficient power delivery; electrified transportation; energy-aware computing platforms. Teaching contributions: Power Electronics; power conversion labs; energy-constrained
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Multiple Tenure-Track Assistant Professor Positions in Microelectronics, Circuits and Systems Design
-bandgap (GaN/SiC) integration; efficient power delivery; electrified transportation; energy-aware computing platforms. Teaching contributions: Power Electronics; power conversion labs; energy-constrained