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., Multiphysics finite element analysis, Matlab, Labview etc.) cleanroom experience, and characterization of electronic devices are required. Further, knowledge of system level integration and haptics feedback in
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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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by working to develop novel algorithms on finite element method, isogeometric analysis, geometric modeling, machine learning and digital twins to study various applications such as computational
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, knowledge about finite-element analysis is an absolute must . Familiarity with iterative solvers , preconditioners , multigrid methods , and mixed-precision approaches is optional but extremely useful. We