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- Carnegie Mellon University
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- Delft University of Technology (TU Delft)
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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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record in theoretical and/or computational mechanics Knowledge, Skills, and Abilities Excellent analytical and mathematical skills Proficiency in numerical analysis using finite element method (FEM
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