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get together outside work, e.g. in one of our communities such as HvAPride, HvA Alumni, HvA United, JongHvA and Fem IT. Take a look at our employment conditions here and learn more about the tailor-made
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colleagues. You and your colleagues can also get together outside work, e.g. in one of our communities such as HvAPride, HvA Alumni, HvA United, JongHvA and Fem IT. Take a look at our employment conditions
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ambitious researcher with a strong background and experience in biomechanics, finite element modelling (FEM), medical image processing, additive manufacturing (AM). The project will be carried out in close
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Expertise in FEM software (ABAQUS, ANSYS, SAP2000) and coding (Python/MATLAB). Professional engineering licensure (HKIE/CEng) or eligibility is a plus. Candidates for Professor or above should have
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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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element Method (FEM) simulations (piezoelectrics and acoustics) Discrete electronic design (Analog and digital design using COTS, schematic and layout design, microcontroller programming, PCB prototyping
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record in theoretical and/or computational mechanics Knowledge, Skills, and Abilities Excellent analytical and mathematical skills Proficiency in numerical analysis using finite element method (FEM
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using both classical and finite element methods (FEM). Review detailed part or assembly definition prior to production release. Examine structural or material discrepancies and create associated