Sort by
Refine Your Search
-
Listed
-
Employer
- Delft University of Technology (TU Delft)
- Utrecht University
- Eindhoven University of Technology (TU/e)
- University of Groningen
- European Space Agency
- Leiden University
- University of Amsterdam (UvA)
- University of Twente (UT)
- Maastricht University (UM)
- Wageningen University & Research
- University of Twente
- Radboud University
- Vrije Universiteit Amsterdam (VU)
- Erasmus University Rotterdam
- University Medical Centre Groningen (UMCG)
- ARCNL
- Erasmus MC (University Medical Center Rotterdam)
- Princess Máxima Center for Pediatric Oncology
- Radboud University Medical Center (Radboudumc)
- Royal Netherlands Academy of Arts and Sciences (KNAW)
- Universiteit Leiden
- University of Utrecht
- 12 more »
- « less
-
Field
- Computer Science
- Engineering
- Biology
- Medical Sciences
- Economics
- Chemistry
- Materials Science
- Science
- Earth Sciences
- Business
- Mathematics
- Philosophy
- Psychology
- Sports and Recreation
- Humanities
- Physics
- Arts and Literature
- Design
- Education
- Electrical Engineering
- Environment
- Law
- Social Sciences
- Statistics
- 14 more »
- « less
-
the Faculty of Science and Engineering (FSE) At the Faculty of Science and Engineering (FSE), we focus on themes such as circularity and sustainability, future farming, digitisation and (scientific
-
Are you excited about pushing the boundaries of ultrasound imaging? Join our team to develop next-generation multi-aperture ultrasound technology combining distributed sensing, adaptive acquisition
-
computational biocatalysis. The position is embedded in Q-MMD, the quantum-simulation programme of the Faculty's Molecular and Material Design Technology Hub. The programme connects four seed projects: quantum
-
University of Technology) Working at TU Delft means contributing to solutions that really make a difference. For over 180 years, we have been training engineers who make an impact worldwide in companies
-
Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
-
such as PyTorch, PyTorch Geometric, DGL, NetworkX, or scikit-learn. Engineering skills and willingness/patience to work with large, noisy datasets, including preprocessing, pipeline development, and
-
4 Jul 2026 Job Information Organisation/Company University of Twente (UT) Research Field Engineering » Aerospace engineering Engineering » Computer engineering Environmental science » Ecology
-
language generation, and NLP and society. The National Police Lab AI is a collaboration between the Netherlands Police, Utrecht University and Delft University of Technology. The lab's research focuses on symbolic AI
-
information about our research group can be found at: https://autonomousrobots.nl/ Job requirements We are looking for a candidate with: A PhD degree in Robotics, Control, Aerospace Engineering, Mechanical
-
the Department of Biomechanical Engineering . In addition there are excellent opportunities for close collaboration with the MESA+ Institute for Nanotechnolgy , and several institutions abroad.