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scheme using only unit processes a production line already runs, and scale the device geometry to aggressive contacted gate pitch by electron-beam or DUV lithography. • Qualify incoming carbon
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correlations, and single-photon detection; and nanofabrication techniques including electron-beam lithography, reactive-ion etching, thin-film deposition, and electron-beam evaporation. 5. Excellent analytical
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nanofabrication, including electron-beam or optical lithography, thin-film deposition, etching, or atomic layer deposition. Optical spectroscopy, confocal microscopy, time-resolved spectroscopy, or single-photon
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techniques, including optical lithography and/or electron-beam lithography. Perform device processing using ICP-RIE and/or ion milling techniques. Analyse structural, electrical, and materials characterisation
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one or more of the following: semiconductor/superconductor nanofabrication processes (thin-film deposition, photo- and electron-beam lithography, and etching); design and testing of cryogenic (< 10 K
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Engineering or Materials Engineering Expertise in Carbon Nanotubes material Experienced with Carbon Nanotubes manipulation Experienced in cleanroom processes such as UV Lithography, E-Beam PVD, Sputtering, RIE
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structures and devices. Hands-on experience with optical characterization techniques. Experience with fabrication of nanomaterials, including electron-beam lithography, photolithography, dry etching, thin-film