Sort by
Refine Your Search
-
Category
-
Program
-
Employer
- Eindhoven University of Technology (TU/e)
- Delft University of Technology (TU Delft)
- Wageningen University & Research
- University of Amsterdam (UvA)
- University of Twente (UT)
- Maastricht University (UM)
- University of Groningen
- Utrecht University
- European Space Agency
- Leiden University
- ARCNL
- Sanquin Blood Supply Foundation (Sanquin)
- University of Twente
- Breda University of Applied Sciences
- Radboud University Medical Center (Radboudumc)
- University Medical Center Utrecht (UMC Utrecht)
- AMOLF
- Amsterdam UMC, location VUmc
- Erasmus University Rotterdam
- KNAW
- Prinses Máxima Centrum
- Radboud University
- Royal Netherlands Academy of Arts and Sciences (KNAW)
- Universiteit Leiden
- 14 more »
- « less
-
Field
-
Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
-
2 Jul 2026 Job Information Organisation/Company Eindhoven University of Technology (TU/e) Research Field Computer science » Cybernetics Computer science » Programming Engineering » Industrial
-
perform desktop studies related to process design and optimization, techno-economic evaluations, and screening of purification technologies. What are you going to do? The main objective of this EngD project
-
Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Integrated optics is currently experiencing unprecedented growth, driven
-
Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description How to best incorporate New Genomic Techniques to solve challenging issues
-
work on plant genetics, growth strategies, and crop management with the aim of achieving optimal crop performance by integrating plant, environment, and management. The position offers close
-
critical for achieving power-efficient operation, programmability, high linearity and low-noise signal conditioning including optimal dynamic range and bandwidth utilization. This position offers a unique
-
economy. Thermal interfaces at cryogenic conditions: Many advanced technologies — like quantum computers, powerful microscopes, and chip-making tools — require extreme cooling. However, the optimal design
-
the project, you will develop and optimize printable materials and fabrication processes for creating conductive tracks, electrodes and other electronic components within soft 3D structures. You will
-
29 Aug 2026 Job Information Organisation/Company ARCNL Research Field Engineering » Computer engineering Engineering » Precision engineering Physics » Computational physics Physics » Metrology