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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Maritime engineering Engineering » Mechanical engineering Researcher Profile
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collaboration with the Department of Advanced Computer Science and the Sensor Engineering group, creating a highly interdisciplinary research environment at the intersection of plant science, engineering, and
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19 Sep 2026 Job Information Organisation/Company Wageningen University & Research Research Field Agricultural sciences » Agricultural products Computer science » Informatics Computer science
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5 Sep 2026 Job Information Organisation/Company Tilburg University Research Field Computer science » Computer hardware Computer science » Programming Engineering » Electrical engineering Engineering
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movement sciences, biomedical engineering, artificial intelligence, computational neuroscience). You have a strong background in empirical research and computational modelling of sensorimotor control and an
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Computer Science The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force
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Biological sciences » Biology Computer science » Informatics Computer science » Programming Researcher Profile Recognised Researcher (R2) Application Deadline 16 Oct 2026 - 21:59 (UTC) Country Netherlands Type
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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for the Protection of Systems and Information (EIPSI), in the department of Mathematics and Computer Science. The work is carried out in collaboration with QUANT at Twente University and QSA Technology, as well as TU
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Join the Veldhorst Group, pioneers in germanium-based quantum computing and simulation. Job description After a successful first hire for this research topic, we are looking for a second