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Explore fundamental spin physics at the interface of acoustics and MRI, and help develop a new imaging contrast sensitive to microscopic magnetic-field inhomogeneities. Job description We
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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, computational biology, computer science, quantum information/quantum computing, computational chemistry, applied mathematics, physics, or a closely related field; have strong programming and computational
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Join TU Delft to uncover the biology of cellular robustness in an industrial yeast process and translate your discoveries into innovative genome engineering strategies. Job description You will join
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Computer science » Programming Engineering » Electrical engineering Engineering » Mechanical
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) Application Deadline 18 Sep 2026 - 21:59 (UTC) Country Netherlands Type of Contract Temporary Job Status Not Applicable Hours Per Week 40.0 Is the job funded through the EU Research Framework Programme? Not
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data would be helpful to validate the microphysics models for ice nucleation process, hence clarifying the different nucleation pathways for ice formation. You will collaborate with other researchers
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You will develop new theoretical methods for quantum sensing with mechanical systems, explore their use in tests of fundamental physics, and help build the research environment of a new theory group
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Are you interested in (re)entering biotech research? This position supports a non-linear career path with a focus on implementing process analytical technology into bioprocesses. Job description