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Responsibilities Lead photonic integrated circuit (PIC) design and simulation using commercial tools. Contribute to novel photonic computing architectures including optical in-memory and
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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19 Sep 2026 Job Information Organisation/Company CNRS Department Institut de physique et chimie des matériaux de Strasbourg Research Field Engineering Computer science Mathematics Researcher Profile
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As a postdoctoral researcher, your primary responsibilities will be: Develop machine learning and deep learning models, with a strong focus on computer vision, for the characterisation and
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the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description The recruited
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transport, microscopy, and optical spectroscopy, to establish links between electronic structure and emerging physical properties. Design and perform optical and electronic characterization of two-dimensional
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computational methods to investigate quantum, optical, thermal and spin-dependent transport in complex materials. A central expertise of the group is the LSQUANT methodology, a suite of linear-scaling, real-space
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, such as optical in-memory computing. The role involves close collaboration with leading fabrication partners (e.g., GlobalFoundries, AIM Photonics), participation in multi-project wafer (MPW) tapeouts, and
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of the following areas is an asset: fluid dynamics, droplet impact, multiphase flow, heat transfer, phase change, high-speed imaging, vacuum systems, optical diagnostics, or surface science. Experience
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and 3D finite element modelling (COMSOL, CST) of the optical control process for materials. -Integration of the optimal compositions into simple test structures to directly evaluate electrical switching