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an international scientific audience Preferred Qualifications: Motivated self-starter with the ability to work independently and to participate creatively in collaborative and frequently interacting teams
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and ductile fracture is preferred. You will be expected to collaborate with research staff and industry partners to support certification and qualification efforts for components produced by various
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monitoring, or manufacturing decision-making. Collaborate with ORNL researchers, technical staff, students, industry partners, and external collaborators to execute project tasks and deliver research outcomes
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and Responsibilities: Collaborate with internal and external researchers on a variety of data and storage-related research projects for use cases in HPC, scientific AI, and scientific edge computing
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Consortium capabilities in materials extraction from alternative resources—both vital to U.S. economic and energy security goals. This incumbent will work in close collaboration with other researchers from
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the proven ability to function well and meet deadlines in a dynamic environment. Ability to work with a measure of autonomy and a willingness to participate creatively in a collaborative, team environment
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of next-generation semiconductor devices. The candidate will collaborate with researchers across CNMS, ORNL, and the broader NSRC network working in materials synthesis, device fabrication, theoretical
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., difference-in-differences). Contributions to reports, presentations, and peer-reviewed journal articles. Collaborate with ORNL scientists involved in these efforts, to gain expertise in the economic analysis
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. The candidate will collaborate with multidisciplinary researchers in robotics, surveying, remote sensing, and artificial intelligence. This on-site position resides in the Building Envelope Materials Research
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an excellent opportunity to collaborate with multi-displinary domain scientists and advance large-scale scientific AI/ML models. Major Duties/Responsibilities: Research and development of scalable AI, ML, and