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. The Institut is hosting more that 120+ research groups and 31 core facilities across 13 departments. The Biomaterials & Microfluidics core facility is at the forefront of organ-on-chip (OoC) technology
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description On-chip fertilization: Making a controlled microfluidic environment to decipher
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Atomic Scale Processing for future chips and energy. The central challenge is to design and control materials at the atomic scale to enable next-generation devices with unprecedented performance
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Director, Communications & Digital Strategy, CHIP Job Profile Title Marketing Coordinator B Job Description Summary The Associate Director of Communications & Digital Strategy is responsible for leading and
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Details Title Postdoctoral Fellow – NHP Immunology and Organ Chips School Wyss Institute for Biologically Inspired Engineering Department/Area Position Description About the Wyss: The Wyss
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required performance, an essential final problem still needs to be resolved. Namely, the connection of the flow sensor chip to the outside world without elastomer seal or glue, since these wetted materials
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sensors themselves are reaching the point that they can meet the required performance, an essential final problem still needs to be resolved. Namely, the connection of the flow sensor chip to the outside
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activities can include: Experimental characterization of spin coherence during shuttling Shuttling-compatible demonstration of high-fidelity qubit control Demonstration of shuttle-based Si/SiGe quantum chips