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) for tape-out. Develop PIC architectures and components for multiplexed spectral processing in silicon nitride devices in the visible/near-infrared. Develop and support internal fabrication of low-loss
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. Familiarity with any of the following is an asset: - UAS detect-and-identify architectures and RF-based mitigation approaches; - Direction-finding and geolocation techniques (TDOA, AOA, FDOA); - RF
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